Intel and Micron Technology said they are shipping samples of jointly designed chips that stack circuitry in layers to boost storage capacity rather than packing smaller components on to a flat square of silicon.
from WSJ.com: US Business http://ift.tt/1GuP9nF
via IFTTT
from WSJ.com: US Business http://ift.tt/1GuP9nF
via IFTTT
No comments:
Post a Comment